ULTRAPOL Advance

Flat Lapping and Polishing Machine

ULTRAPOL Advance has been designed to be an all-in-one lapping & polishing workstation for the production of flat surfaces. Advance’s unbeatable combination of advanced control and process features allow for the accurate processing of modern generations of IC’s.

Key applications of the technology include:

Topside electronic de-processing – enabled by the advanced angular control and optical enhancements such as ULTRACOLLIMATOR.
Backside preparation of packages and wafers, particularly for flip-chips – and rapid global thinning of larger surfaces.
Cross-sectioning of die and package-level devices.

Along with ULTRA TEC’s signature Quick Release interface and workholder technologies, ULTRAPOL Advance offers completely new designs for sample loading, oscillation and tilt alignment.

Fast and convenient sample movement between polisher & microscope, coupled with the option of ULTRACOLLIMATOR optical alignment system, provides reference to the die — a huge improvement over earlier generation polishers.

ULTRAPOL Advance enables recirculating slurry polishing (key for many delayering operations) as well as standard faucet coolant. For aggressive material removal operations (such as the back-thinning of larger flip chips), a ‘Power polish’ mode is incorporated that rotates the sample during processing.

Better processing results – ULTRA-COLLIMATOR option allows for improved parallelism, improving the overall flatness ‘sweet spot’ of the delayered surface
Fast & repeatable alignment – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis, provide for repeatable optical alignment ‘to the die’
Slurry polishing – A recirculating pump may be added, in addition to the standard water coolant system.
Avoids cross-contamination – The unique slurry / drip tray concept allows convenient removal and cleaning

Please see below for more details

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Specifications

Please Contact us for a copy of the ULTRAPOL Advance Datasheet

Speed control	50 to 400rpm
Polishing plate	8” (200mm)
Z-height control	1μm precision
Sample Rotation and sweep controls	2 circle tilt control (+/- 2 degrees)
Sample Load Control	0 to 3 kg
Quick release interface mounting system
Two sample mounting plates and start-up accessory kit.
Mechanical alignment indicator
Solenoid Controlled Coolant System.
Slurry Containment Tray
Power Requirements	Configured for 100-220/240V

Features and Specifications subject to change without notice

Optional Features

Please Contact us for a copy of the ASAP-1® IN SITU Datasheet

SEM & FIB STUB POLISHING HOLDERS

Part #	Item	Description
3250.1	ULTRAPOL Advance Polishing System	Includes: Base unit with timer, oscillator, speed control (50 to 400rpm), 8” (200mm) Polishing plate, Z-height control with 1μm precision, Mechanical alignment indicator, 2 circle tilt control (+/- 2 degrees) Sample Rotation and sweep controls, Quick release interface mounting system, two sample mounting plates and start-up accessory kit. Sample Load Control – 0 to 3 kg. Solenoid Controlled Coolant System. Slurry Containment Tray.
6183.UL	ULTRACOLLIMATOR LASER ALIGNMENT UPGRADE	Includes: Laser module, cross-hair generator, and 6.5 inch lcd monitor, with Video Out (ntsc). Includes optical flat and mounting bracket for ULTRAPOL Advance
POLISHING ACCESSORIES
6189.1	Hotplate Transfer Device
6178.1	Mounting Stand for SEM Stubs
1503.1	Disc Holding Band
CROSS-SECTION HOLDERS
6124.1	Encapsulated Mount Fixture	Holds 0.5 inch to 1.5 inch diameter mounts
6150.1	Quick Release Vise for holding package	For large dice, waveguides etc
6145.1	Single Die Stub	Cross-section holder
SEM & FIB STUB POLISHING HOLDERS
6172.H	Hitachi SEM & FIB STUB POLISHING HOLDER	6175.H Stub Only
6172.J	JEOL SEM & FIB STUB POLISHING HOLDER	6175.J Stub Only
6172.F	FEI SEM & FIB STUB POLISHING HOLDER	6175.F Stub Only
6172.P	Philips SEM & FIB STUB POLISHING HOLDER	6175.P Stub Only
6172.Z	Zeiss SEM & FIB STUB POLISHING HOLDER	6175.Z Stub Only