ASAP-1® IN SITU
Digital Selected Area Preparation System
ASAP-1® IPS is a digital sample preparation system for the decapsulation, thinning and polishing of die, package, module and wafer-level devices. The upgraded 2nd generation ASAP-1® IPS adds a suite of key feature upgrades.
Drawing on ULTRA TEC’s market knowledge and long-standing leadership in electronic device sample preparation, IPS is ‘device-centric’ – designed to surpass the non-destructive, high yield and survivability results for labs analyzing micro-electronic components.
Machine vision cameras provide an unique ALWAYS-LIVE image of the device under test, along with key navigational and process controls. Auto head lift and lower, and optional fluid control system improves the user experience. IPS’ Touch Screen OS has been re-designed to control all aspects of the sample preparation process.
- Die, package, wafer and board-level
- Accurately decaps, thins & polishes
- 2 UHD Stage Cameras – front & side
- Target Camera and overlay software options
- NIR led upgrade option
- MArket-leading Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
Please see below for further details
Please Contact us for a copy of the ASAP-1® IN SITU Datasheet
| Z-Vertical Direction Precision | 0.04 microns (40 nanometers) minimum step-size |
| Table Precision (X & Y Travel) | 0.2 microns (200 nanometers) minimum step-size |
| Table Travel Amplitude | 100mm x 100mm (max.) |
| Polishing Method | Patented ASAP-1® Float-down head, with Z-lock, enhanced with electronic sensors and tool patterns (ASAP-1® Classic, ASAP-1® X, ASAP-1® Swap, Serpentine, User-defined X-Y, Spiral, Frame, and Relief) |
| Sample Tilt Control | Automated 2-circle tilt control (+/- 5 degrees) |
| Force Control | 1000 grams (max) with 1gram precision. Overall accuracy +/- 10 grams |
| Video | Realtime 10.1inch (255mm) touchscreen monitor, overlaid with stage and process variables. HDMI Video-Out for (optional) external monitor. 4.25inch (108mm) secondary touchscreen |
| Programming Input Method | Touchscreen, joystick and 3 physical rotary encoders. Optional wireless keyboard and mouse. File load/save to flash drive. Remote programming |
| Core Software Features | Drop-down menu interface for File handling, Cam Select, zoom, and image enhancement, Overlays, Tool Diameter, Pattern Select, Force Control, timers, LED Illumination, Set-points, Touch-off. Additional purchased options unlock menus for RST, 3D controls, thermal, end-point |
| Process Camera | Two 4K UHD Cameras provide real-time video at 45 degrees to tool/surface interface – front and side |
| Power Requirements | Universal: 100-120VAC; 200-240VAC (Single Phase). Power Consumption: 300 Watts Maximum in use |
| Footprint | 19 inches (480mm) Width x 27.5 inches (698 mm) Depth x 27 Inches (685mm) Height |
| Weight | 200lbs (91 kg) |
** Features and Specifications subject to change without notice **
Note: ASAP-1® is a Registered Trademark. Portions of the Technology are covered under US and related Worldwide patents – 6,630,369 ; 6,781,232 & 7,066,788. 3 more Patent Pending.
Please Contact us for a copy of the ASAP-1® IN SITU Datasheet
KEY FEATURES INCLUDE: |
NEW AND UPGRADED FOR 2024 MODE: |
| · Accurately decaps, thins & polishes · Deep sub-micron control in X, Y and Z axes · For die, package, wafer, and board-level devices · Full 100 x 100 mm max. stage area |
· Live Process Video from 2 UHD cameras · Large touchscreen with physical joystick & encoders · Keyboard and Mouse control · Expanded choice of tool bits · Fluid control system · Stage illumination · Image optimization, metrology and zoom · Auto-tilt stage · Auto head lift and lower |
*
OPTIONS |
Part # |
Item |
Description: |
| 6760.7 | ASAP-1® IPS (2024 Model) | DIGITAL Selected Area Preparation System, (100-240V, 50/60Hz). Includes: X-Y table, tool spindle drive with sub-micron Z-resolution, +5/-5 degree automated tilt-table, integrated real-time machine vision, min 10-inch touchscreen lcd monitor, set of 2mm and 3mm tools, 6389.1 Force Feedback module. Two 4K UHD Cameras (Process) |
| 6675.1 | Machine Vision Monitor | 24-inch (min) monitor machine vision upgrade for improved In Situ view of polishing tip/sample surface interface, includes stand (VESA mount) |
| 6677.1 | Fluid Control System (FCS) | Auto dispense and collect system for polishing fluids and abrasives. Three input lines |
| 6682.1 | Thermal Acclimation Plate | Adds ability to allow inlet fluid from FCS to reach required process temperature |
| 6687.1 | Target Camera | 4K UHD Camera provides top-down X-Y positional targeting |
| 6688.1 | Overlay Software | Adds overlay capability for imported image to be overlaid on live target cam view. Imported image can be from x-ray, C-SAM, design, or saved image |
| 6692.1 | NIR Stage Illumination | NIR LEDs to enhance imaging of device with system cameras |
| 6394.3 | 3D MODULE – Curvature & Mesh |
System software upgrade to add processing and compensation for sample surface curvature with adaptive mesh overlay |
| 6686.1 | 3D MODULE – Heat & Cool Thermal Relaxation | Hardware and Software Upgrade to add thermal relaxation capability. Touch-Panel screen controls. Peltier-based heating plate, Chiller unit. Includes cables, and two mounting plates. Hot Plate Mode |
| 6368.1 | CHARACTERISATION MODULE – Capacitive/Resistive End-Point Module | Hardware and Software Upgrade to add end-pointing for enhancement of decapsulation performance |
** Features and Specifications subject to change without notice **
Video coming soon!
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