ASAP-1® IN SITU

5-Axis CNC Mill for Selected Area Sample Preparation

Building on more than 25 years of product development and customer input, ASAP-1® In Situ is our flagship bench-top milling, decapsulation, and sample prep system.

ASAP-1® In Situ includes a new OS, driven by a large touchscreen and/or mouse & keyboard — or even programmed remotely — that allows for control of all
process parameters. Stage illumination has been further improved, with the addition of NIR LEDs. Three standard UHD cameras (target, front & side process) ensure the process can be monitored live.

An ‘open’ physical design allows ASAP-1® In Situ to successfully process the widest size range of IC package — from the tiniest surface mount components, right up to the largest aerospace modules/motherboards and selected areas of a 300mm wafer.

Along with legacy thermal, end-pointing and curvature compensation options, ASAP-1® In Situ can be fitted with a through-silicon RST Measurement System — allowing in situ mapping of remaining silicon across the die without sample transfer — thus avoiding translation errors.

• IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
• Adaptive 3D Mesh & Curve Mapping
• Import Overlays – use X-RAY, C-SAM images to improve targeting
• Two RST Versions available-  NIR  (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
• High-Def Digital Cameras — all native 4K (UHD)
• Option for (up to) 32” Vision Monitor
• Program by Touch, Mouse/Keyboard or REMOTELY

Please see below for more details