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PlasmaEtch

Proprietary Decapsulation Process

  • No Ultrasonic Required
  • Patented MIP Technology: US Patent Number 9,548,227
  • Best Solution for Silver Wires
  • Etches a Wide Variety of Package Types
  • Completely Wet Chemical-free Decap
  • Eco-friendly
  • Touchscreen Interface
  • PC/Windows-based GUI
  • Etches Samples with All Wire Types
  • Small Footprint Suited for Tabletop

Innovative Features of PlasmaEtch

  • Downstream Focused Plasma Etching
  • Mass Flow Controlling for All Gases
  • No Microwave Radiation Exposure to Samples
  • Low Temperature Etching
  • Isotropic Etching
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MIP Etching

As the world moves toward more eco-friendly processes and the semiconductor manufacturing industry continues to make smaller parts with sensitive internal components, failure analysts are presented with a unique challenge: how do you etch these samples? Nisene Technology Group has bridged the gap between semiconductor manufacturing technology and failure analysis with its latest decapsulation system: the PlasmaEtch.

It Works. Here’s How.

The PlasmaEtch decapsulation system is a revolutionary patented gas-based semiconductor etching system (US patent number 9,548,227). Employing a never-before-seen application of microwaved gases inciting chemical radicals for isotropic etching, the PlasmaEtch is the greenest and most cost-effective etching solution available. Using microwave-induced plasma — or MIP — etching, the PlasmaEtch can decapsulate most sample sizes, encapsulant types, and wire bond types. Whether it’s a more traditional gold wire sample, or if the sample features copper or silver wires, the PlasmaEtch delivers a safe and reliable etch.

Unlike typical and less sophisticated plasma decap systems that take may hours or even days to get to the surface of the die, the PlasmaEtch can clear the encapsulant of most package types and reveal the complete die surface and wire sweep in a matter of a couple hours. Chemical-free decapsulation has never been so effective.

Other MIP systems out there rely heavily on the usage of ultrasonication as part of their process. The PlasmaEtch’s MIP etching is such that it uses carefully programmed recipes with high-accuracy mass flow controllers (MFC) in conjunction with a process chamber at vacuum to remove encapsulant in a fast and effective way — without the need for ultrasonic or any additional processes!

Highlights Include:

  • Highly Customizable Etch Recipes
  • Etches a Wide Variety of Package Types
  • Completely Chemical-free Decap
  • Eco-friendly
  • Touchscreen Interface
  • PC/Windows-based GUI
  • The Only Solution for Silver Wires
  • Etches Samples with All Wire Types
  • Small Footprint Suited for Tabletop

Features and Specifications subject to change without notice

Dimensions 38h x 24w x 29d (in) / 965h x 610w x 737d (mm)
Weight 200 lb / 91 kg
Electrical Main: 110 VAC, 1ø or 240 VAC, 1ø
Secondary: 415 VAC, 3ø (Vacuum Pump)
Pneumatic CDA: 70 – 100 psi Regulated
N2: 80 – 100 psi Regulated
Microwave Generator 2450 MHz ± 25 MHz Auto Tuning, 90 – 264 VAC 0 – 200 Watt, Air-cooled
Vacuum Pump 23.3 CFM Rotary Vane Pump with Chemical Filtration and Demister Oil Return
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