Proprietary Decapsulation Process

  • No Ultrasonic Required
  • Patented MIP Technology: US Patent Number 9,548,227
  • Best Solution for Silver Wires
  • Etches a Wide Variety of Package Types
  • Completely Wet Chemical-free Decap
  • Eco-friendly
  • Touchscreen Interface
  • PC/Windows-based GUI
  • Etches Samples with All Wire Types
  • Small Footprint Suited for Tabletop

Innovative Features of PlasmaEtch

  • Downstream Focused Plasma Etching
  • Mass Flow Controlling for All Gases
  • No Microwave Radiation Exposure to Samples
  • Low Temperature Etching
  • Isotropic Etching
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