JetEtch TotalPROTECT

The JetEtch Pro TotalPROTECT is the latest in a series of innovative solutions for the failure analysis industry from Nisene Technology Group.

The JetEtch TotalPROTECT is the world’s most advanced decapsulation system. With an unequalled feature set, the JetEtch TotalPROTECT can etch the widest variety of integrated circuits of any system on the market, while maintaining the integrity of sensitive internal components. Its operation is similar to that of Nisene’s other industry-leading JetEtch products. It retains the intuitive user interface, premier etching capabilities, and robust safety features you’ve come to expect from Nisene Technology Group equipment.

In addition, the JetEtch Pro TotalPROTECT incorporates the patented bias voltage application process capability of the JetEtch CuPROTECT. It also has a special cooling feature that allows sub-ambient cooling of the etching acid. When combined with the bias voltage application process, the JetEtch TotalPROTECT offers the end user a tremendous range of etching parameters for virtually endless recipe combinations – making it the total package for total protection of sensitive components.

Proprietary Cu Decapsulation Process

  • Etches the widest variety of integrated circuits of any system on the market.
  • Maintains the integrity of sensitive components.
  • Incorporates patented bias voltage application process.
  • Allows sub-ambient cooling of the etching acid through special cooling feature.
  • Offers tremendous range of etching parameters for virtually limitless recipe combinations.

Innovative Features of JetEtch Pro

  • Industry-leading safety features
  • Faster etch processing times
  • Flexible etch head designs
  • Superior pump longevity
  • The most effective software in the industry

Etch Modes

Vortex Etch
Vortex Etch produces an etch cavity with extremely straight sidewalls when used with lower-temperature nitric or mixed-acid ratios. The straight sidewalls result from the bidirectional acid flow combined with the abrasive action of non-soluble encapsulant filler that is released from the plastic polymer as the encapsulation is dissolved. Vortex Etch is the preferred method for the precise opening of small cavities when using either nitric or concentrated sulfuric acid.

Pulse Etch
Pulse Etch generally uses greater acid flow rates than Vortex Etch. The result is an etch cavity with a more curved sidewall. Typically, Pulse Etch is ideal for opening large cavities. This is often the preferred method for exposing second bonds when etching ICs that do not have chip-scale configuration.

++JetEtch Pro Minimal Etchant Use
The JetEtch Pro is designed to minimize acid use. Acid volume is software selectable from 1–10 mL/minute. Our efficient design means that whether using Vortex or Pulse Etch mode, opening any package never requires etchant flow rates greater than 1–10 mL/minute.

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