Vortex Etch produces an etch cavity with extremely straight sidewalls when used with lower-temperature nitric or mixed-acid ratios. The straight sidewalls result from the bidirectional acid flow combined with the abrasive action of non-soluble encapsulant filler that is released from the plastic polymer as the encapsulation is dissolved. Vortex Etch is the preferred method for the precise opening of small cavities when using either nitric or concentrated sulfuric acid.
Pulse Etch generally uses greater acid flow rates than Vortex Etch. The result is an etch cavity with a more curved sidewall. Typically, Pulse Etch is ideal for opening large cavities. This is often the preferred method for exposing second bonds when etching ICs that do not have chip-scale configuration.
++JetEtch Pro Minimal Etchant Use
The JetEtch Pro is designed to minimize acid use. Acid volume is software selectable from 1–10 mL/minute. Our efficient design means that whether using Vortex or Pulse Etch mode, opening any package never requires etchant flow rates greater than 1–10 mL/minute.