The JetEtch CuPROTECT is the world’s most advanced decapsulation system.

Employing a proprietary electrolysis process,* its operation is similar to that of Nisene’s industry-leading JetEtch products. It retains the intuitive user interface, premier etching capabilities, and robust safety features customers have come to expect from Nisene Technology Group. In addition the JetEtch CuPROTECT incorporates a unique decapsulation process that specifically targets the removal of a wide variety of mold compounds while protecting and maintaining the integrity of sensitive copper wires.

Unlike less-sophisticated decapsulation systems that cannot etch integrated circuits with copper wires while maintaining their electrical integrity, the JetEtch Pro CuPROTECT can etch virtually any package, with any wire thickness, and yield results that facilitate a host of post-decapsulation failure analysis tests — from bond pull testing to electrical conductivity and resistance.

Proprietary Cu Decapsulation Process

  • Specifically designed for processing integrated circuits with copper wires.
  • Targets the removal of a wide variety of mold compounds while maintaining the integrity of sensitive copper wires.
  • Results that Etches virtually any package with any wire thickness
  • Produces facilitate a host of post-decapsulation failure analysis tests.

Innovative Features of JetEtch Pro

  • Industry-leading safety features
  • Faster etch processing times
  • Flexible etch head designs
  • Superior pump longevity
  • The most effective software in the industry

Etch Modes

Vortex Etch
Vortex Etch produces an etch cavity with extremely straight sidewalls when used with lower-temperature nitric or mixed-acid ratios. The straight sidewalls result from the bidirectional acid flow combined with the abrasive action of non-soluble encapsulant filler that is released from the plastic polymer as the encapsulation is dissolved. Vortex Etch is the preferred method for the precise opening of small cavities when using either nitric or concentrated sulfuric acid.

Pulse Etch
Pulse Etch generally uses greater acid flow rates than Vortex Etch. The result is an etch cavity with a more curved sidewall. Typically, Pulse Etch is ideal for opening large cavities. This is often the preferred method for exposing second bonds when etching ICs that do not have chip-scale configuration.

++JetEtch Pro Minimal Etchant Use
The JetEtch Pro is designed to minimize acid use. Acid volume is software selectable from 1–10 mL/minute. Our efficient design means that whether using Vortex or Pulse Etch mode, opening any package never requires etchant flow rates greater than 1–10 mL/minute.

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