VERSA Double Sided Probe Station
The first true system-level Flip Chip & Double Sided probe system with above and below ambient temperature capabilities.
“The patented Micromanipulator VERSA system combines a compatible probe station that has been specifically designed to consider wafer-level probe capability to the test board level and assist with post-tape-out product testing, wafer-level testing, and now double-sided probing needs”.
The VERSA enables you to probe decapsulated IC’s mounted onto test boards at above and below ambient temperatures without limiting your board’s ability to exercise your chip and without limiting the probing capability employed at the wafer level. Using the VERSA, you can trace and analyze issues that manifest only in the actual end application environment faster, easier, and with less headache than previously possible.
- Double-sided probing and imaging
- Probe decapsulated IC’s, wafers, and large boards up to 26″ square, all at temperature.
- -40C to 125C configurable
- Integrated vibration isolation platform
- Magnetic field options
- Patented
The worlds first true system level Flip Chip & Double Sided probe system with above and below ambient temperature capabilities.
With the VERSA, you can probe:
- Application boards measuring up to 26″ square in ambient mode, and up to 18″ in temperature mode.
- Wafers up to 450mm.
- Wafer pieces and oddly shaped/sized test samples.
- Temperature range supported: frost free -40C to 125C.
- Flip Chip/Dual Sided Probing and imaging
VERSA Double sided Probe Station includes:
- Flip Chip/Dual Sided Probing camera systems with integrated high resolution positioning
- Flip Chip/Dual Sided Probing device holders
- Integrated vibration isolation base platform.
- Upgradeable temperature option. Choose frost free -40C to 125C, or ambient to 400°C
- Microscope system of your choice.
- Large translation manual microscope motion with precise fine motion.
- Two independent, moveable platen.
- Choice of Manipulators (up to 10).
- Large choice of Probe holders and tips including passive, active, RF, and many more.
Features and Specifications subject to change without notice
| System | <200mm, 200mm, 300mm, System Level/Packaged Part |
| System Capability | Hot/Cold, Microprobing |
| System Control | Manual |
| System Value Considerations | Custom Configured Systems, Research |
| Dimensions | Assembled Dimensions: TBC Assembled Weight: TBC |
| Microscope & Optics | Microscope gantry allows you to move across the entire 26” x 26” testing area. Supports all optical microscopes. Add a second tool with the large gantry for even more testing options. |
| Stage Area | Ambient 26” x 26” testing area. 200mm – 300mm chuck standard. 10”x10” – 18’x18” thermal chamber standard. Enough space to set up several devices simultaneously. VERSA allows us to make the right staging area for you. |
| Customizing Options | Thermal Chambers, Thermal Chucks, Laser Ready, Electro-magnet capable, VERSA ambient with 300mm wafer, VERSA ambient with board holder, VERSA with 18”x18” thermal chamber, Fine positioning stages, Double side probing/viewing, RF & DC Positioners, Wafer chuck & board holders |
Features and Specifications subject to change without notice