The first true system-level Flip Chip & Double Sided probe system with above and below ambient temperature capabilities.
“The patented Micromanipulator VERSA system combines a compatible probe station that has been specifically designed to consider wafer-level probe capability to the test board level and assist with post-tape-out product testing, wafer-level testing, and now double-sided probing needs”.
The VERSA enables you to probe decapsulated IC’s mounted onto test boards at above and below ambient temperatures without limiting your board’s ability to exercise your chip and without limiting the probing capability employed at the wafer level. Using the VERSA, you can trace and analyze issues that manifest only in the actual end application environment faster, easier, and with less headache than previously possible.
- Double-sided probing and imaging
- Probe decapsulated IC’s, wafers, and large boards up to 26″ square, all at temperature.
- -40C to 125C configurable
- Integrated vibration isolation platform
- Magnetic field options