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Pelco Flexscribe

The new FlexScribe Station is a super-fast, simple method for downsizing wafers and samples by scribing on the topside. It uses a carbide scribing wheel mounted to a sliding scribing mechanism that always makes a straight scribe. This new product is used to scribe a wide variety of materials without restrictions on shape, including glass slides, coverslips, silicon, III-V, sapphire and other crystalline and brittle materials. It can address very small samples down to 5 mm up to 200 mm wafers.

The standard tungsten carbide cutter installed on the FlexScribe is a great for a wide variety of samples including silicon, glass, GaAs and other crystalline materials.

Part Number          Description

54340                      PELCO® FlexScribe™ 200 Front-Side Scribing Tool for up to 200mm Wafers

54342                      PELCO® FlexScribe™ 300 Front-Side Scribing Tool for up to 300mm Wafers

We also recommend:

  • 54343 diamond cutter for very thin glass, tempered glass, and hard materials such as sapphire
  • 54344 For applications cleaving 100 silicon at 45 degrees and for thick glass.
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