Laser Etch LE1064

The Next Generation Laser System for Decapping IC packages.

Solution for Silver Bond Wires.
Etches a Wide Variety of Package Types
Wet Chemical-free Decap Eco-friendly
Touchscreen Interface
PC/Windows 10-based GUI

Laser decapsulation is a highly precise and effective method of removing plastic encapsulant material from a device.

Using a 20W 1064nm laser, the encapsulant material is vaporized, eliminating the risk of accidentally destroying or washing away a defect with decapsulation chemicals.

This method is particularly useful for small or oddly-shaped devices that would be challenging to expose chemically. Additionally, laser decapsulation reduces the need for chemical consumables.

The advanced in-line camera with laser technology enables simultaneous viewing and etching of devices. With a large optical zoom of 18x, the camera can view devices ranging from 1mm to 100mm in size.

Experience precision and efficiency with cutting-edge technology.

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Features

Capable of decapsulating IC packages less than 1mm x 1mm
Capable of decapuslating IC packages 10mm or thicker
Capable of cutting IC packages
Real-time video monitoring
High Resolution Camera ≥ 2 Megapixels
Camera optical zoom up to 18x
Image saving
Filtration System
Compliant with class 10k cleanroom
Equipped with HEPA filter with Extra Filter and carbon filter
Fume extractor included
Positionable exhaust inlet
Integrated interface (e.g. power and sleep) or interlock with exhaust/filtration system

Specification

Features and Specifications subject to change without notice

High Quality Laser	Air cooled 1065nm Fiber Laser
Laser Power:	20watts
Pulse Width:	Adjustable 9ns-200ns
Frequency:	1Khz-1Mhz
Scanning	Galvo
Class Safety:	Class1
Zoom Lens:	Large 18x Optical Zoom
Camera:	8 megapix color
Laser Pointer Focus Aid
Optional:	Motorized Z axis
Optional:	Motorized XYZ with Automated Jedec Tray Decapsulation
Warranty:	12-month warranty including parts and labor (Excludes consumable items adn mis-use)