The use of fuming Nitric / Sulphuric acid are effective for removal of resin during the decapsulation process of many common IC packages, however there’s a growing number of devices such as power devices that are manufactured using hard resin compounds that are heat-resistant but also acid-resistant, thus reducing the effectiveness of acid decapsulation and in some cases prevent successful decapsulation.

The solution to successful decapsulation of such hard resin devices is to use the HiSOL laser Decap Pro 2 for a pre-cavitation step to quickly remove the bulk of resin from the sample leaving just a thin layer for removal using acid. Processing on none white/translucent ceramics is also possible.

The user friendly Laser Pro 2 has processing area up to 120mmx 120mm, multi-scanning directions of 90° and 45° to reduce unevenness and a high resolution 12M Pixel camera with zoom function to clearly observe bond wire exposure in real time.

The Laser Pro 2 can also be utilised for Marking using specialized software for QR Codes, characters and graphics

Standard two year warranty is included and minimal maintenance is required. At the end of laser life just the laser diode can be replaced significantly reducing the cost compared to replacing the complete laser head as in other systems.

Safety laser and door interlocks. EMO and key-switch isolation.

CE certificated