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Laser Pro2

Laser decapsulation system for decapping IC packages with high speed, no damage.

Decapsulation pre-cavitaion step for IC’s manufactured using hard resin compounds and similar devices

Access to ceramic packages from the back side

Processing area up to 120mmx 120mm

Multi-scanning directions of 90° and 45° to reduce unevenness

High resolution 12M Pixel camera with zoom function to clearly observe bond wire exposure in real time.

Specialized software for IC decapsulation and in addition can be used for laser marking QR Codes, characters and graphics

Laser diode can be replaced rather than complete laser head resulting in lower maintenance cost

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